[ATM] soldering SMPs
Arjan te Marvelde
Arjan.te.Marvelde at hetnet.nl
Sat Dec 15 07:46:38 JST 2007
> excess. One technique for soldering ICs is to flood the pins with
> solder, then use the braid to remove the excess, just leaving solder
> under the pins.
This is what I do, down to 0.8mm pitch.
Best to use small quantities of flux, to improve sucking the surplus tin
away with the desoldering litze.
See: http://home.hetnet.nl/~artm/atm/stepper/protoboard.html#result bottom
of the page.
The DACs are the most challenging devices.
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