[ATM] soldering SMPs

[Arjan te Marvelde]

> excess. One technique for soldering ICs is to flood the pins with
> solder, then use the braid to remove the excess, just leaving solder
> under the pins.

This is what I do, down to 0.8mm pitch.
Best to use small quantities of flux, to improve sucking the surplus tin 
away with the desoldering litze.

See: http://home.hetnet.nl/~artm/atm/stepper/protoboard.html#result bottom 
of the page.
The DACs are the most challenging devices.

Arjan